ICP Etcher conducts chemical & physical etching by generating high-density plasma in low-pressure process. It shows excellent etching performance at target materials which have high-hardness(Sapphire, SiC, etc.), organic matter(Polyimide, etc.), Ⅲ-Ⅴ compounds and glass.
- • 2-8 inch on tray w/he cooling
- • 23-26pcs/2", 7-8pcs/4", 3pcs/8", 1pcs/8"
- • Conventional or Reverse process chamber
- • LAH(automatic), LCH(semi-auto)
- • 2 Maxis™300L process modules
- • 4-8 inch single stand alone chamber
- • Mechanical or ESC available
- • Si, glass, sapphire, Sic substrate
- • EDA optional
* Click above images to see more information of each products.